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REWORK SYSTEMS

Auto / Vision Assisted

Our Automated rework system provides precise placement of Surface Mount devices including BGAs, CSPs, QFNs, FlipChips, microBGAs and other area arrays such as BGA Sockets. Advanced SMT rework accomplished by using optimum combination of Convection and Infrared heating technologies.

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DISPENSERS

Automated: Dotliner
Manual: Clever | Smart

Extremely repeatable Dispensing of solder paste, adhesives, underfills and other materials. Consistent volumetric output independent of variations in pressure, syringe level and temperature. Easily integrates with automated equipment and offers material heating and cooling provisions.

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STAND ALONE MINI-OVEN

BGA Reballing | QFN Solder Bumping

Fast and easy to use, stand-alone MiniOven for BGA, CSP and area array reballing along with QFN prebumping (solder paste printing and reflow). This highly effective Convection / Infrared system includes closed-loop heating control, multi-program modes and offers an inert atmosphere.

UNDERHEATERS

Hot Beam Underheaters

A comprehensive offering of IR underheaters for mini to oversized PCBs. With fast temperature ramp rates and even heat distribution, PCBs and components are subjected to less stress.