SMART DESOLDER 01
Contactless Extraction of Residual Solder
The SMART DESOLDER 01 combines a manual hot-gas source with a vacuum pen for non-contact extraction of residual solder. This process-controlled method has advantages over hand wick (braid) techniques by effortlessly removing components without applying and re-applying heat and pressure to the PCB over and over.
Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after component removal. The temperature-controlled airflow prevents the neighboring components from heating up.
After melting, the residual solder is removed – without contact – using a vacuum pen. The Teflon tip in the vacuum pen offers outstanding features: a nonstick effect, temperature-resistance, and a soft surface material with a long shelf life.
As a compact stand-alone device, it virtually fits on any work bench and can be operated very easily for practically any service mount device.
The Martin bottom heaters HOTBEAM 04 or 05 perfectly complement the SMART DESOLDER 01. They optimize the temperature curve by means of a sensor-based or programmed preheating profile.
Please CONTACT US for additional information.
Technical Data Sheet: SMART-DESOLDER-01-e