Mini Oven – BGA Reballing / QFN Prebumping

The Mini-Oven can reball a diverse range of BGAs, QFNs and CSPs. The unit offers programmable modes and nitrogen process gas supply.
Processes can be completed in as little as 3 minutes.  The unit also handles QFN prebumping.


Extensive selection of interchangeable frames and adjustable masks / stencils. Customized projects are welcomed. Whether it’s a small I/O device, to one with hundreds or thousands of spheres, the Mini Oven for reball handles the task.


Rapid Technology profiles heat at the highest advisable
ramp rates within a safe temperature zone.